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| 产品特性：工业主板 | 品牌：DFI | 型号：COM335 |
| 设备类型：工控电脑 |
COM Express® R3.1, Pin-out Type 6 & Type 10
Support Compact and Mini modules
Multiple displays: VGA, LVDS, DP, eDP
Rich I/O: 1 GbE, 3 USB 3.1, 4 USB 2.0
microATX form factor
显示
显示器
1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DP
1 x eDP/LVDS (LVDS available upon request)
扩充
界面
1 x PCIe x16
1 x PCIe x4
3 x PCIe x1
1 x M.2 B Key 3042/3052
1 x SDIO
音讯
音讯编译码器
Realtek ALC888S-VD2-GR
输入/输出
以太网络
1 x GbE (RJ-45)
USB
3 x USB 3.1 (Gen 2)
4 x USB 2.0
屏幕
3 x DP
音源
1 x Line-in
1 x Line-out
1 x Mic-in
内部输入/输出
串行端口
1 x Serial Interface Connector (TX/RX)
显示
1 x VGA (2.54mm)
1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power
1 x eDP LCD Panel Connector
音效
1 x Audio (Line-out/Mic-in)
1 x S/PDIF
SATA
4 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO
LPC
1 x LPC
SMBus
1 x SMBus
电源
类型
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
端口
2x 4-pin power connector
8.5V-20V DC-in jack
RTC 电池
CR2032 Coin Cell
环境指标
温度
Operating: 0 to 60°C
Storage: -40 to 85°C
湿度
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
495,767 hrs @ 25C; 284,320 hrs @ 45C;
181,227 hrs @ 60C; 133,598 hrs @ 70C; 84,828 hrs @85C
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
机械结构
尺寸
microATX Form Factor
244mm (9.6") x 244mm (9.6")
规范
PICMG COM Express® R3.1, Type 6 & Type 10
Compact, Mini Module
安规认证
认证
CE, FCC, RoHS, UKCA
装箱单
装箱单
• 1 COM335 board
• 1 Serial ATA data cable (Length: 500mm), 332-553001-005G
