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| 产品特性：工业主板 | 品牌：DFI | 型号：COM337 |
| 设备类型：工控电脑 |
COM HPC Mini Carrier Board
Multiple Displays: 2 DP++, eDP
Multiple Expansion: 1 PCIe x8, 2 PCIe x4, 1 M.2 E Key 2230
Rich I/O: 2 2.5 GbE, 4 USB 3.2, 2 USB4 (Type-C)
microATX form factor
显示
显示器
2 x DP++
1 x eDP
扩充
界面
1 x PCIe x8
2 x PCIe x4
1 x M.2 E Key 2230
音讯
音讯编译码器
Realtek ALC888S-VD2-GR
输入/输出
以太网络
2 x 2.5 GbE (RJ-45)
串口
2 x DB9 (4-wires UART 0/1)
USB
2 x USB4 Type-C (co-layout w/USB3.2, available upon request)
4 x USB 3. 2 (Gen 2)
屏幕
2 x DP
音源
1 x Line-in
1 x Line-out
1 x Mic-in
内部输入/输出
显示
1x eDP LCD Panel Connector
音效
1 x Audio (Line-out/Mic-in)
1 x S/PDIF
SATA
2 x SATA 3.0 (up to 6Gb/s)
2 x SATA Power
DIO
1 x 12-bit DIO
SMBus
1 x SMBus
CANBus
1 x CAN bus
I2C
2 x I2C
风扇
1 x SYS_FAN (SmartFan support)
eSPI
1 x eSPI
GP SPI
1 x GP_SPI
SPI
1 x SPI
电源
类型
1x 8-pin ATX power connector (12V DC_In)
8.5V-20V DC in jack
端口
1 x 8-pin ATX power connector
1 x DC-in jack
RTC 电池
CR2032 Coin Cell
环境指标
温度
Operating: -40 to 85°C
Storage: -40 to 85°C
湿度
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
机械结构
尺寸
microATX Form Factor
244mm (9.6") x 244mm (9.6")
规范
PICMG® COM-HPC® R1.3
安规认证
认证
CE, FCC, RoHS
装箱单
装箱单
• 1 COM337 board
