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| 产品特性:工业主板 | 品牌:DFI | 型号:RPS330-Q670E/H610E |
| 设备类型:工控电脑 |
BTL-S/14th/13th/12th Gen Intel® Core™ with Intel® Q670E/H610E chipset
4 DDR5 UDIMM up to 192GB
Supports 3 independent displays: VGA, DP++, HDMI
Supports 4K resolution
Multiple Expansion: 1 PCIe x16, 1 PCIe x4, 2 PCI, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
Rich I/O: 1 Intel 2.5GbE, 1 Intel 1GbE, 6 COM, USB 3.2 Gen 2 (Q670E 4x), USB 3.2 Gen 1 (Q670E 2x, H610E 4x), USB 2.0 (Q670E 7x, H610E 6x)
Typically supports 10-Year CPU Life Cycle Until Q1’32 (Based on Intel IOTG Roadmap)
Support EXT-OOB (Full)
系统
处理器
Intel® Bartlett Lake-S P-Core Only LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ 9 273PQE (12 Cores, 36M Cache, up to 5.9 GHz); 125W
Intel® Core™ 9 273PE (12 Cores, 36M Cache, up to 5.7 GHz); 65W
Intel® Core™ 9 273PTE (12 Cores, 36M Cache, up to 5.5 GHz); 45W
Intel® Core™ 7 253PQE (10 Cores, 33M Cache, up to 5.7 GHz); 125W
Intel® Core™ 7 253PE (10 Cores, 33M Cache, up to 5.5 GHz); 65W
Intel® Core™ 7 253PTE (10 Cores, 33M Cache, up to 5.4 GHz); 45W
Intel® Core™ 5 223PQE (8 Cores, 24M Cache, up to 5.5 GHz); 125W
Intel® Core™ 5 223PE (8 Cores, 24M Cache, up to 5.4 GHz); 65W
Intel® Core™ 5 223PTE (8 Cores, 24M Cache, up to 5.4 GHz); 45W
Intel® Core™ 5 213PE (8 Cores, 24M Cache, up to 5.2 GHz); 65W
Intel® Core™ 5 213PTE (8 Cores, 24M Cache, up to 5.2 GHz); 45W
Intel® Bartlett Lake-S Hybrid LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ 7 251E (24 Cores, 36M Cache, up to 5.6 GHz); 65W
Intel® Core™ 7 251TE (24 Cores, 36M Cache, up to 5.4 GHz); 45W
Intel® Core™ 5 221E (14 Cores, 24M Cache, up to 5.2 GHz); 65W
Intel® Core™ 5 221TE (14 Cores, 24M Cache, up to 5.0 GHz); 45W
Intel® Core™ 5 211E (10 Cores, 20M Cache, up to 4.9 GHz); 65W
Intel® Core™ 5 211TE (10 Cores, 20M Cache, up to 4.8 GHz); 45W
Intel® Core™ 3 201E (4 Cores, 12M Cache, up to 4.8 GHz); 60W
Intel® Core™ 3 201TE (4 Cores, 12M Cache, up to 4.6 GHz); 45W
14th Generation P-Core Only Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ i9-14901E (8 Cores, 36M Cache, up to 5.6 GHz); 65W
Intel® Core™ i9-14901TE (8 Cores, 36M Cache, up to 5.5 GHz); 45W
Intel® Core™ i7-14701E (8 Cores, 33M Cache, up to 5.4 GHz); 65W
Intel® Core™ i7-14701TE (8 Cores, 33M Cache, up to 5.2 GHz); 45W
Intel® Core™ i5-14501E (6 Cores, 24M Cache, up to 5.2 GHz); 65W
Intel® Core™ i5-14501TE (6 Cores, 24M Cache, up to 5.1 GHz); 45W
Intel® Core™ i5-14401E (6 Cores, 24M Cache, up to 4.7 GHz); 65W
Intel® Core™ i5-14401TE (6 Cores, 24M Cache, up to 4.5 GHz); 45W
14th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ I9-14900 (24 Cores, 36M Cache, up to 5.8 GHz); 65W
Intel® Core™ I9-14900T (24 Cores, 36M Cache, up to 5.5 GHz); 35W
Intel® Core™ I7-14700 (20 Cores, 33M Cache, up to 5.4 GHz); 65W
Intel® Core™ I7-14700T (20 Cores, 33M Cache, up to 5.2 GHz); 35W
Intel® Core™ I5-14500 (14 Cores, 24M Cache, up to 5 GHz); 65W
Intel® Core™ I5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); 35W
Intel® Core™ I5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); 65W
Intel® Core™ I5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); 35W
Intel® Core™ I3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); 60W
Intel® Core™ I3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); 35W
Intel® 300 (2 Cores, 6M Cache, up to 3.9 GHz); 46W
Intel® 300T (2 Cores, 6M Cache, up to 3.4 GHz); 35W
13th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W
Intel® Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W
Intel® Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W
Intel® Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W
Intel® Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W
Intel® Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W
Intel® Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W
Intel® Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W
Intel® Core™ I3-13100E (4 Cores, 12M Cache, up to 4.4 GHz); 60W
Intel® Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W
Intel® Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W
12th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); 65W
Intel® Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); 65W
Intel® Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); 35W
Intel® Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); 65W
Intel® Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); 35W
Intel® Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); 60W
Intel® Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); 46W
Intel® Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); 35W
Intel® Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); 46W
Intel® Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz); 35W
芯片组
RPS330-Q670E
Intel® Q670E Chipset
RPS330-H610E
Intel® H610E Chipset
内存
RPS330-Q670E
Four 288-pin UDIMM up to 192GB (Non-ECC)
Dual Channel DDR5 up to 4400MHz
RPS330-H610E
Two 288-pin UDIMM up to 96GB (Non-ECC)
Dual Channel DDR5 up to 4400MHz
*Speed support list follow User’s Manual
BIOS
AMI SPI 256Mbit
显示
控制器
Intel® UHD Graphics 700 series
特性
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
显示器
1 x VGA
1 x DP++
1 x HDMI 2.0a
VGA: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2304 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz
三重显示
VGA + DP++ + HDMI
扩充
界面
1 x PCIe x16 (Gen 5)
1 x PCIe x4 (Gen 3) (opt. share M.2 M-key, function selected by BIOS.)
2 x PCI
M.2
RPS330-Q670E
1 x M.2 2242/2260/2280 M key (PCIe x2 NVMe/SATA/Intel RST support)
1 x M.2 2242/2260/2280 M key (PCIe x4 NVMe/Intel RST support) (share PCIE x4 slot, function selected by BIOS.)
1 x M.2 2230 E key (PCIe/USB 2.0/Intel CNVi support) (Discrete Wifi 6E support)
RPS330-H610E
1 x M.2 2242/2260/2280 M key (PCIe x2 NVMe/SATA/Intel RST support)
1 x M.2 2242/2260/2280 M key (PCIe x4 NVMe/Intel RST support) (share PCIE x4 slot, function selected by BIOS.)
音讯
音讯编译码器
Realtek ALC888
以太网路
控制器
RPS330-Q670E
1 x Intel® I226-LM or I219-LM (Core i9/i7/i5 support iAMT)
1 x Intel® I226-V
RPS330-H610E
1 x Intel® I219-V
1 x Intel® I226-V
背板输入/输出
以太网络
RPS330-Q670E
2 x 2.5GbE (RJ-45)
or 1 x 2.5GbE + 1 x GbE (RJ-45)
RPS330-H610E
1 x 2.5GbE + 1 x GbE (RJ-45)
串口
1 x RS-232/422/485 (RS-232 w/ power) (DB-9)
USB
RPS330-Q670E
4 x USB 3.2 Gen 2
2 x USB 2.0
RPS330-H610E
2 x USB 3.2 Gen 2
2 x USB 3.2 Gen1
2 x USB 2.0
PS/2
1 x PS/2 (mini-DIN-6)
显示
1 x DP++
1 x HDMI 2.0a
1 x VGA
音源
1 x Line-out
1 x Mic-in
1 x Line-in (opt. by request, MOQ required)
内部输入/输出
串行端口
1 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)
USB
RPS330-Q670E
2 x USB 3.2 Gen1
4 x USB 2.0 (2.54mm pitch)
1 x USB 2.0 vertical Type A
RPS330-H610E
3 x USB 2.0 (2.54mm pitch)
1 x USB 2.0 vertical Type A
音效
1 x Front Audio Header
1 x S/PDIF
SATA
RPS330-Q670E
4 x SATA 3.0 (up to 6Gb/s) (one port share M.2 M-key (SATA))
(RAID 0/1/5/10)
RPS330-H610E
4 x SATA 3.0 (up to 6Gb/s) (one port share M.2 M-key (SATA))
DIO
4-IN / 8-OUT DIO
SMBus
1 x SMBus
监视定时器
看门狗定时器
System Reset, Programmable via Software from 1 to 255 Seconds
安全性
信赖平台模块
Nuvoton TPM 2.0
电源
类型
ATX
端口
8-pin ATX 12V power
24-pin ATX power
耗能
Typical: i9-14900K: 3.3V @ 0.5A (1.65W); 5V @ 1.6A (8W); 12V @ 5.3A (63.6W)
Max.: i9-14900K: 3.3V @ 1.1A (3.63W); 5V @ 4.1A (20.5W); 12V @ 23A (276W)
RTC 电池
CR2032 Coin Cell
支持操作系统
微软
Windows 10 IoT Enterprise 64-bit
Windows 11 LTSC
Linux
Linux
环境指标
温度
Operating: -5 to 65°C
Storage: -20 to 70°C with RTC Battery; -40 to 85°C without RTC Battery
湿度
Operating: 5 to 95% RH
Storage: 5 to 95% RH
MTBF
RPS330-Q670E
486,088 hrs @ 25°C ; 276,007 hrs @ 45°C ; 173,159 hrs @ 60°C ; 125,815 hrs @ 70°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled
RPS330-H610E
492,561 hrs @ 25°C ; 281,444 hrs @ 45°C ; 177,236 hrs @ 60°C ; 129,021 hrs @ 70°C
Calculation Model: Telcordia Issue 4
Environment: GB, GC - Ground Benign, Controlled
机械结构
尺寸
microATX Form Factor
244mm (9.6") x 244mm (9.6")
高度
PCB: 1.6mm
Top Side: 37.7mm
Bottom Side: 3.25mm
安规认证
认证
CE, FCC Class B, RoHS, UKCA
装箱单
装箱单
• 1 RPS330-Q670E/H610E motherboard
• 1 COM port cable (Length: 300mm, 2 x COM ports), A81-015026-023G
• 1 Serial ATA data cable (Length: 500mm), 332-553001-005G
• 1 I/O shield, A49-CMS631-000G